TES announces the availability of D/AVE 3D, HW 3D IP for integration into ASIC and FPGAs. D/AVE 3D supports industry standrad OpenGL ES 1.1 and OpenVG 1.01 API for use in Automotive, Mobile, Avionics and Industrial devices . D/AVE 3D offers high performance per-primitive anti-aliasing, texture compression,edge-based filtering, A VSP ( Vertex Stream Processor ) that enables OpenGL ES 2.0 like vertex shader support. D/AVE 3D supports high performance of upto 16 Million triangles/sec and 266 mega pixels/sec fill rates on ASICS. With complete end-to-end solutions in embedded graphics customers of D/AVE are enabled with support for developing enhanced GUI with Guiliani, 3D MAP Sandbox and Graphics evaluation boards. This General availability of D/AVE 3D comes after successful licensing of D/AVE 3D by NEC Electronics.