AMD has teamed up with the University of Illinois to urge students in the development of codes for the company’s GPGPU inside Fusion processors.
AMD supports languages including C++ AMP and OpenCL for GPGPU offload and as such, the company clearly feels it's time to bring the technology to a new audience under a more professional brand identity. Fusion System Architecture (FSA) will now be known as Heterogeneous Systems Architecture (HSA). The HSA platform will continue to be rooted in industry standards and will include some of the best innovations that the technology community has to offer.
Hindawi Publishing Corporation has issued a call for papers on Parallel and Distributed Computing Challenges in Bioinformatics for the Advances in Bioinformatics peer-reviewed, open access journal. Hindawi Publishing Corporation is a commercial publisher of peer-reviewed journals covering a wide range of academic disciplines. Complete guidelines are available here.
"Despite the last few years of dismal news on the employment front, software engineers with backgrounds in high performance computing are in high demand. This is mainly due to the fact that HPC systems require engineers trained in the intricacies of parallel programming -- OpenCL, MPI, OpenMP, CUDA, and such. While these software frameworks are well known in the HPC realm, most computer science programs do not offer classes in them at the undergrad level. And there are only a handful of specialized HPC curriculums in the country, most of which are associated with DOE or NSF supercomputing centers." The Khronos Group is hoping that their Khronos Institute of Training and Education (KITE) initiative will help to ease the void in this field.
Intel introduced at CES the world's first smartphone based on the company's Atom Z2460 platform formerly code-named Medfield. The new Lenovo K800 handset will be available in Q2 2012 in China and will be the first smartphone ever to use an x86 microprocessor. Intel Medfield is powered by Atom architecture 1.60GHz x86 core with Hyper-Threading technology, enhanced Intel Deeper Sleep, C6E estate, S0i1/S0i3 power reduction features and 512KB of cache. The SoC also includes Intel GMA graphics core with OpenGL ES 2.0 and OpenVG 1.1 with hardware accelerated high-definition 1080p video playback, 32-bit LPDDR2 memory controller and Intel's new image signal processor.
Version 0.9.10 of the free open-source, cross-platform 3D application framework PixelLight has been released. We're using OpenGL as well as GLSL within our main-renderer and OpenGL ES 2.0 for Android. From this release on we officially support 64 bit. New developers joint the team and enabled us to do further bug fixing, stabilisation of the technology and to enhance the CMake based build system to make it easier to build PixelLight from it's sources.
As Henrik points out in a video soundbyte, making amazing 3D graphics as easy to create as “view source” has got to be good for humanity, right?
Rightware announced the release of Power Board, an online benchmarking database service, and Basemark™ ES 2.0 Taiji Free, a consumer-version of the industry’s standard graphics benchmarking product. Basemark™ ES 2.0 Taiji Free for Android-based smartphones, tablets and other embedded devices can be downloaded from Google’s Android Market and from Rightware’s website.
We're excited to announce the kick off of our Pokki 1UP $50k HTML5 game development challenge. The first place game developer will take home $30k and win a trip to the Game Developers Conference 2012 in San Francisco where we will feature their game! We've pulled together a top notch panel of game developer leaders to judge submissions which must be submitted by February 20th, 2012 at 11:59pm (PST). What's also cool is that we just launched support for WebGL, WebSockets, and the Web Audio API. We're really excited about cutting edge HTML5 technologies like canvas, CSS3, WebGL and Web Audio. There's already been some impressive demos with these technologies and we're looking forward to seeing what the Pokki game developers come up with.
AMD is using the Taiwan Semiconductor Manufacturing Companies new 28nm manufacturing process to build the new high-end Radeon HD 7970 GPU. The HD 7970 sports 4.3 billion transistors in a 365mm2 die. The 7970 supports OpenCL and OpenGL 4.2. It is assembled from 32 GCN compute units, which translates to 2,048 stream processors, each based on AMD’s new SIMD-plus-scalar architecture. As well, the 7970 includes 768KB of L2 cache and eight render back-ends, features a 384-bit interface to 3GB GDDR5 memory and a PCIe 3.0 interface. The GPU is capable of peak throughput of 264GB/s.