Khronos royalty-free open standards for 3D graphics, Virtual and Augmented Reality, Parallel Computing, Machine Learning, and Vision Processing

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The release of the OpenCL 3.0 specification was a significant milestone for this open standard for low-level heterogeneous parallel programming, creating a pervasive baseline that can be cleanly extended with new functionality requested by developers. But a strong open standard ecosystem is much more than just an API document and Khronos is making significant investments to improve the OpenCL developer experience. Read on to discover the latest updates to the OpenCL SDK and what is coming on the SDK roadmap!

AUTOSAR™ (AUTomotive Open System ARchitecture) and The Khronos® Group have signed a Memorandum of Understanding and entered into a collaboration liaison to foster synergy between the two organizations to encourage standardization in the field of Automotive and Future Intelligent Mobility. This joint technical collaboration between AUTOSAR and Khronos is intended to coordinate common requirements and developments with a focus on accelerated graphics and computing in safety critical markets.

LLVM recently released Clang 14. New OpenCL features include the ability to generate a SPIR-V binary, support for OpenCL 3.0 and more…

Khronos has introduced a new extension named VK_EXT_graphics_pipeline_library that allows for shaders to be compiled much earlier than at full Pipeline State Object (PSO) creation time. By leveraging this extension, I was able to avoid many causes of frame hitches due to PSOs being late-created at draw time in the Source 2 Vulkan renderer. The extension spec was released today and SDK support will follow soon.

Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.

Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world’s leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.