China’s National University of Defense Technology, is the world’s new No. 1 system with a performance of 33.86 petaflop/s on the Linpack benchmark, according to the 41stedition of the twice-yearlyTOP500 list of the world’s most powerful supercomputers. The surprise appearance of Tianhe-2, two years ahead of the expected deployment, marks China’s first return to the No. 1 position since November 2010, when Tianhe-1A was the top system. Tianhe-2 has 16,000 nodes, each with two Intel Xeon IvyBridge processors and three Xeon Phi processors for a combined total of 3,120,000 computing cores.
ARM has announced the Cortex-A12, a mid-range target solution, with support for OpenGL ES 3.0. The new CPU core design is meant to deliver a 40 percent performance bump over Cortex-A9 designs. As well, the Cortex-A12 includes an improved GPU, the Mali-T622, which packs support for the Mali-V500 video engine and OpenGL ES 3.0 standard.
Using WebGL, Pics.io is planning on launching a browser-based service to let people more easily tap into raw photography with their browsers. Pics.io startup founded by a Ukrainian trio thinks it's time for the Web browser to take on a computing task that so far has resisted the shift toward cloud computing: raw photo editing.
The Khronos Group has posted two videos from the Spring Meetup. A complete list is available on the event archive page along with links to the press releases and photos. More video's will come online shortly. Currently available are the COLLADA Meetup video, and the joint Khronos Group, PC Gaming Alliance News Conference.
AMD just announced the immediate availability of the Catalyst 13.6 Windows Driver. Highlights in this release include AMD GPU & AMD APU OpenCL 1.2 acceleration in Adobe Premiere PRO CC, product support for the new AMD A10, A8, A6, and A4 Series APUs on desktop and mobile platforms and AMD Enduro technology enhancements.
SIGGRAPH Asia 2013 program submission deadlines are fast approaching. Submit your best work today to get an opportunity to present your talent in Hong Kong this November!
OpenCL is an industry standard programming model available on a wide range of platforms from multiple vendors. It is an established technology that has been in use commercially for several years. It is not used in the academic community, however, anywhere near as much as it could be. To help correct this shortcoming, the creators of OpenCL (the Khronos Open Standards group) is launching a program to fund a number of course development projects. We do not anticipate that the level of funding associated with this program will cover the full cost of course development. Rather, our funds will augment OpenCL courseware projects in place or in the planning stages. If this type of course development sounds interesting to you, read the entire call for proposals.
Join us for the first Khronos Boston Chapter Meetup at the British Beer Company in Framingham, MA on Tuesday, June 11th at 6:00PM. The event will feature a talk introducing the newly released OpenGL ES 3.0. After the talk, there will be time for demos and networking. Come learn about OpenGL ES 3.0 and meet others in the Boston area that are interested in 3D graphics with OpenGL, OpenGL ES, and WebGL.
Version 2 adds support for ETC2 and EAC textures and conversion of legacy LUMINANCE* and INTENSITY* formats when loading in an OpenGL core context. It includes KTX loader tests for OpenGL ES 3.0 and OpenGL 3.3. In addition a couple of nasty bugs have been fixed including one in the KTX writer where image rows were not padded to 4 bytes as required by the spec. Complete details of the changes are located in the OpenGL ES SDK. A new version of toktx has also been released. New features are ability to create KTX files with textures in sized internal formats and defaulting to RED and RG formats for 1 and 2 channel textures. Naturally it incorporates the bug-fixed writer from libktx. Visit the KTX home page to download these tools.
ARM® TechCon 2013 is "Where Intelligence Connects." By bringing together software and hardware communities with ARM Ecosystem Partners and ARM technology, this year’s event uniquely connects talents cross functionally to ignite progressive design optimization and accelerated time-to-market launches. ARM TechCon’s learning ground as such is designed with combined sessions for chip designers, system implementation engineers, and software developers in a shared venue, facilitating communities’ interaction, learning and collaboration. ARM TechCon Call for Abstracts includes 15 tracks that reflect this theme, giving you a broader and deeper audience to present to and collaborate with. Do you have proven innovation applications and plans that incorporate ARM innovation? Review the tracks and submit by May 31 for ARM TechCon 2013, which starts October 29-31, 2013 at the Santa Clara Convention Center.